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IBM Research Hardware Developer United States, New York, City of Albany 537096770
24.06.2024
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Your Role and Responsibilities
Required Education: master degree
Preferred Education: Ph.D.
Preferred Education: Ph.D.
Required Technical and Professional Expertise
1) Experience with flip chip underfill/molding process
2) Experience with flip chip assembly (Die-to-Die, Die-to-wafer, Die-to-substrate)
3) Basic understanding of packaging/assembly processes, material, laminate, and tools
4) Ability to debug errors and solve problems
5) Ability to work in a team environment
Required Education: master degree
Preferred Education: Ph.D.
2) Experience with flip chip assembly (Die-to-Die, Die-to-wafer, Die-to-substrate)
3) Basic understanding of packaging/assembly processes, material, laminate, and tools
4) Ability to debug errors and solve problems
5) Ability to work in a team environment
Required Education: master degree
Preferred Education: Ph.D.
Preferred Technical and Professional Expertise
- 1) Hands-on experience in semiconductor packaging technology
2) Experience in flip chip assembly process, laminate technology,
packaging reliability test, failure analysis, and semiconductor process.
3) Experience with/ design of experiments, process controls, and statistical data analysis.
Required Education: master degree
Preferred Education: Ph.D.
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