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IBM Research Hardware Developer United States, New York, City of Albany 848623676
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Preferred Technical and Professional Expertise
1) Hands on experience in semiconductor 3D packaging technology,
2) Experience of flip chip assembly process (TCB, reflow), laminate technology, packaging reliability test, failure analysis, and semiconductor process,
3) Experience w/ design of experiments, process controls, and statistical data analysis,
2) Experience of flip chip assembly process (TCB, reflow), laminate technology, packaging reliability test, failure analysis, and semiconductor process,
3) Experience w/ design of experiments, process controls, and statistical data analysis,
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