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IBM Research Hardware Developer Senior professional United States, New York, City of Albany 206838557
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Required Technical and Professional Expertise
1) More than 8 years experience with 3D flip chip assembly, reliability testing, and failure analysis,
2) Basic understanding of wafer level packaging/assembly processes, laminate, reliability test, and tools ,
3) Ability to drive joint development with tooling/material supplier,
4) Positive and self-motivated and excellent presentation skills,
5) Ability to work in a team environment and to debug errors and solve problems.
2) Basic understanding of wafer level packaging/assembly processes, laminate, reliability test, and tools ,
3) Ability to drive joint development with tooling/material supplier,
4) Positive and self-motivated and excellent presentation skills,
5) Ability to work in a team environment and to debug errors and solve problems.
Preferred Technical and Professional Expertise
1) Hands on experience in semiconductor 3D packaging technology,
2) More than 8 years experience of flip chip assembly process (TCB, reflow), laminate technology, packaging reliability test, failure analysis, and semiconductor process,
3) Experience w/ design of experiments, process controls, and statistical data analysis,
2) More than 8 years experience of flip chip assembly process (TCB, reflow), laminate technology, packaging reliability test, failure analysis, and semiconductor process,
3) Experience w/ design of experiments, process controls, and statistical data analysis,
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