Account Technologist Iv - E4 Pvd Advanced Packaging jobs at Applied Materials in Taiwan, Hsinchu

Key Responsibilities

• Act as the primary interface for TSMC on Varian implant tools OR Advanced Packaging applications, ensuring Applied Materials secures opportunities in advanced nodes and packaging technologies.
• Develop and implement account strategies to support technology transitions.
• Lead negotiations on tool bridging, warranty extensions, and resource planning for fab ramp-up and high-volume manufacturing.
• Consolidate risk assessments and opportunity applications across multiple nodes; ensure Applied Materials maintains competitive positioning.
• Coordinate new tool introductions, NSO (New System Orders), and relocation requirements for advanced fabs.
• Engage with TSMC R&D teams to influence design-to-order (DTO) decisions.
• Present Applied Materials’ product roadmap and capabilities; communicate customer requirements to internal product teams.
• Prepare and negotiate pricing proposals, manage order booking, and monitor account receivables.
• Maintain detailed documentation of customer interactions, visit summaries, and action plans; ensure timely execution.

Requirements

• M.S. or B.S. degree in Engineering or related field.
• 2+ years of semiconductor sales experience with one or more of the following tools: DDP, CMP, ETCH, IMP, MDP, PDC, FEP.
• Proven experience in technical sales or account management, preferably with TSMC or semiconductor industry customers.
• Strong interpersonal and communication skills with ability to influence at all levels.
• Excellent English communication and presentation skills.
• Ability to travel as needed (approx. 20%).

Key Responsibilities

Enable Next-Gen Solutions Through Direct Engagement:

• Act as the technical owner for PVD solutions at assigned OSATs and Fabless accounts, ensuring alignment between design requirements and manufacturing processes.

• Understand Customers and Fabless stakes holders technical roadmap.

• Partner with Fabless packaging architects to define material stacks, reliability criteria, and integration flows; translate these into executable solutions for OSATs.

• Lead joint qualification programs involving Fabless and OSAT stakeholders: define success metrics, DoEs, and acceptance gates; manage execution to schedule.

Process Qualification & Ramp:

• Establish process-of-record (POR) for advanced packaging applications (e.g., RDL barrier/seed, TSV liners, hybrid bonding underlayers).

• Drive tool acceptance (FAT/SAT) and HVM ramp at OSAT sites: SPC setup, chamber matching, defectivity control, and yield stabilization.

• Validate PVD film integrity under Fabless-driven reliability tests (JEDEC/IPC standards: EM, TDDB, thermal cycling).

Cross-Functional Collaboration:

• Coordinate with Applied Materials’ Product Engineering, Field Service, and Quality teams to deliver robust solutions tailored to OSAT and Fabless needs.

• Resolve integration challenges across packaging flows (e.g., ESD, adhesion, contamination, stress) through structured problem-solving.

Continuous Improvement:

• Lead structured root cause analysis on yield/reliability excursions; implement corrective actions and verify effectiveness.

• Provide feedback to internal engineering for hardware and process enhancements based on OSAT and Fabless requirements.

Required Qualifications

• Bachelor’s or Master’s in Materials Science, Physics, Chemical Engineering, or related field; PhD preferred.

• 10+ years in semiconductor equipment/process engineering with strong PVD experience in Advanced Packaging (FO-WLP, 2.5D/3D, RDL/UBM).

• Proven success enabling solutions through direct engagement with OSATs and Fabless design houses.

Preferred Qualifications

• Experience enabling hybrid bonding or chiplet integration through PVD underlayers.

• Familiarity with APAC OSAT ecosystem and Fabless packaging roadmaps.

• Proficiency in SPC, DOE, metrology, and yield analytics.

• Expertise in thin-film metallurgy (Cu, Ni, Ti, Ta/TaN, Co) and reliability-critical stack design.

• Strong communication skills to engage executive Fabless stakeholders and OSAT engineering teams.

What We Offer

Role Responsibilities:

• Lead process experiments, data analysis, and reporting across multiple products
• Characterize hardware and define methods using advanced plasma etch techniques (ICP, CCP, RIE, ion beam)
• Act as Product Manager, coordinating with field teams, customers, and engineering
• Provide technical training to field teams for new product introductions
• Collaborate with TSMC F20 and support on-site engineering needs
• Travel annually to Gloucester BU for product alignment and team collaboration
• Develop and execute engineering projects, troubleshoot issues, and guide junior engineers
• Create technical documentation and specifications
• Engage with vendors and lead cross-functional projects as needed

Qualifications:

• Master’s degree or above in a STEM-related field (PhD is a plus)
• 10+ years of hands-on experience in plasma etch
• Strong semiconductor engineering background
• Experience working with TSMC, managing cross-functional initiatives, or leading new product introductions
• Proven ability in complex problem solving and cross-team communication

Job Profile

Industrial Engineer (E4)

KEY RESPONSIBILITIES

• Manages and participate in complex Industrial Engineering and Operations Research related projects to improve semiconductors productivity and efficiency.
• Conduct a current-state assessment of business processes and identification of improvement opportunities. Based on this assessment, design, implement, and manage process improvement initiatives utilizing Lean Six Sigma methodologies.
• Train, mentor, and coach Champions, in the use of Six Sigma tools and methodology to ensure timely completion of projects with expected client results.
• Participate in productivity improvement studies such as cycle time reduction, Gemba and output improvement, and implementation in related to effective and efficient use of assets and production processes.
• Use Industrial Engineering technique such as time studies, simulation, value stream analysis, business process re-engineering, lean six sigma and Gemba to analyze and quantify and improve semiconductors fab’s operations.
• Develops continual improvement roadmap and oversees the deployment of these strategies across multiple functions.
• Used Applied Materials software (Simulation and other propriety applications) to develop models to automate the process of data analytics.
• Develop and implement models for cost, capacity, staffing and cycle time.
• Manage cost of ownership projects (CoO). Engage with customers to identifying and driving cost reduction, quantify the value of CIP’s and improvement projects, develop a CoO pareto with Year over Year targets and roadmap.

FUNCTIONAL KNOWLEDGE

• Regarded as the technical expert in Industrial Engineering and Operations Research in the semiconductor industry
• Demonstrates in-depth and/or breadth of expertise in Industrial Engineering and broad knowledge of semiconductor operations
• Direct experience with demonstrated success and financial results leading Six Sigma transactional & manufacturing projects
• Technical mastery of Six Sigma tools and methodologies including DMAIC, DFSS, and Lean
• Effective change agent, able to implement strategic initiatives in an organization
• Must possess effective project management skills and ability to influence at all levels of an organization

BUSINESS EXPERTISE

• Anticipates business and regulatory issues; recommends product, process or service improvements.
• Utilize benchmarking to identify best practices, both internal and external to the organization.
• Comfortable presenting findings and recommendations to key executives.
• Semiconductor industry experience.

LEADERSHIP

• Ability to lead and influence others within a matrix organization.
• Lead strategic projects while managing risk and resource requirements.
• Ability to effectively coach and mentor Champions and Process Owners.
• Resolvesobstacles/roadblocks,serves as a sounding board for problem resolution.

PROBLEM SOLVING

• Solves unique and complex problems with broad impact on the business; requires conceptual and innovative thinking to develop solutions

Education:

• Bachelor's Degree or master’s degree in Industrial Engineering.
• Green Belt, Black Belt certification preferred.

7+ years in semiconductor industry, 3+ Years of Continuous Improvement experience required

Additional Job Description

Time Type - Full time

Scheduled Weekly Hours - 40

Work Shift - 10-Day 8-Hr (United States of America)

Cost Center - 200385-[0027] I/E Taiwan

What We Offer

Responsibilities:

• Provide high-visibility customer support through on-site installations, system diagnoses, and the service and repair of complex systems and equipment
• Work closely with the customer to develop leading-edge processes used to manufacture the most advanced semiconductor chips, many of which are inside everyday electronic devices
• Create hypothesis experiments and design of experiments (DOE); analyze data with statistics; and compile reports with high-level conclusions on technically challenging process engineering experiments
• Troubleshoot complex problems; perform multiple root cause analysis; and resolve a variety of difficult process engineering and customer product issues
• Communicate with both internal stakeholders and the customer to achieve goals with a focus on building relationships and establishing trust
• Apply your growing knowledge of best practices to offer a new perspective using existing solutions
• Serve as a resource for junior colleagues and a liaison between the customer and business unit; you may also lead small projects with manageable risks and resource requirements

Qualifications:

• Master’s degree or PhDin chemistry/ physics, materials engineering, electrical engineering, optoelectronics or related field
• 5-10 years of experience in the semiconductor fab or equipment industry. In-depth knowledge of process integration or metal technologies is highly preferred
• Strong interpersonal and communication skills to explain sensitive information and work to build consensus among project stakeholders
• Communication proficiency in English language

Applied Materials is the global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to work beyond the cutting-edge, continuously pushing the boundaries of science and engineering to make possible the next generations of technology, join us to Make Possible® a Better Future.

What We Offer

At Applied, we prioritize the well-being of you and your family and encourage you to bring your best self to work. Your happiness, health, and resiliency are at the core of our benefits and wellness programs. Our robust total rewards package makes it easier to take care of your whole self and your whole family. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our .

You’ll also benefit from a supportive work culture that encourages you to learn, develop and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more about careers at Applied.

Key Responsibilities

• Lead the development, optimization, and deployment of advanced packaging technologies.
• Act as the primary technical liaison to TSMC’s Advanced Packaging team, supporting both tactical and strategic initiatives.
• Drive customer engagement through demos, early learning systems, evaluations, and first-in-fab projects.
• Run reqular technical review meeting (TRM), be the technical voice of customer (VoC) , positively influencing product developing roadmap at early design phases .
• Collaborate with senior customer stakeholders to align roadmap , solve integration ,complex process challenges, improving yield, productivity, and cost efficiency .
• Deliver clear, data-driven technical reports and recommendations to internal teams and external partners.
• Build and mentor a high-performing technical team, fostering innovation and cross-functional collaboration.
• Contribute to long-term technology roadmaps and strategic planning for advanced packaging solutions.
• Introduce and implement new analytical methodologies to improve process control and standardization.
• Promote knowledge sharing and best practices across business units and product lines.

Qualifications

• Master’s or Ph.D. degree in Materials Science, Chemical Engineering, or Electrical Engineering.
• 15+ years of experience in the semiconductor industry, witha strong focus on advanced packaging R&D.
• Proven track record in new product introduction (NPI) and cross-functional technical program leadership
• Demonstrated success in technical project management and customer engagement, particularly in development-stage technologies.
• Strong leadership and team management capabilities, with the ability to mentor and grow high-performing technical teams.
• Excellent communication skills in English; Mandarin proficiency is required.
• Willingness to travel domestically and internationally as needed.

Employee Type:

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.