Applied Materials Packaging Engineering Program Manager - E5 

United States, California 

971368350

MS or PhD in Electrical, Mechanical Engineering, Material Engineering or equivalent

Technical Expertise:

Wafer to wafer bonding - including fusion and hybrid bonding, complex heterogeneous wafer level packaging, TSV, die to wafer bonding, advanced substrate and chip on wafer stacking.

Program management, Timeline management, Budget Management, Strong Interpersonal skills, Leadership, Oral and written communications in English.

Responsibilities:

• The successful candidate will be responsible for:
• Program Managing customer engagements in Advanced Packaging, by creating timelines, budgets, manage the technology risks, create roadmaps and execute to set plans to budget and time.
• Developing new modules leveraging Applied’s wide equipment portfolio and help advice the packaging Business Unit on equipment requirements for Advanced semiconductor packaging.
• Filing new patentable developments.
• Being an engineering expert in semiconductor packaging and help drive cross functional projects by working with engineers, managers and directors/Senior directors across Applied’s business units, including the packaging business unit.
• Helping structure and maintain Applied’s roadmap in Packaging modules.
• Representing Integration Module Solutions (IMS) as a module specialist to various business units within Applied and to customers, outside Applied.
• Defining engineering plans, design DOEs, help characterize and create engineering reports for advanced packaging.
• Creating roadmaps for some packaging applications and helping to shepherd Applied’s product portfolio.
• Lead project across organization and culture in a fast-paced environment
• Self-starter, team player and able to work independently with minimal supervision

Bachelor's Degree

10 - 15 Years

Full time

Assignee / Regular

$144,000.00 - $198,000.00