Applied Materials Packaging Engineer E5 

United States, California 

789366326

Key attributes of a successful candidate:

• Domain expertise in W2W hybrid and fusion bonding with deep understanding of materials, process device physics and integration.
• Ability to drive new materials and process development to enable 3D NAND pitch scaling through structured problem solving methodology.
• Proven track record of solving complex problems by working effectively with cross-functional teams across different business units.
• Ability to define and develop differentiated modules for W2W hybrid bonding by leveraging Applied Materials broad portfolio of tools.

• Applied Materials

Qualifications

• Minimum of BS/MS in Electrical, Mechanical Engineering, Material Engineering or equivalent
• 5 years of experience inW2W bonding specializing in 3D NAND (preferred) or CIS.
• Experience with MES systems for 300mm Si processing is preferred.
• Strong communication skills to be effective in dealing with Business Units, cross-functional teams, internal or external manufacturing and customer
• Lead project across organization and culture in a fast-paced environment
• Self-starter, team player and able to work independently with minimal supervision

QualificationsBachelor's Degree

10 - 15 Years

Full time

Assignee / Regular

$132,000.00 - $181,500.00