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In this position, you will support semiconductor failure analysis Lab activities hands-on/on-site work for electrical FAFI (Failure Analysis and Fault Isolation)and physical silicon debug.FAFI team is focused on isolating silicon level failures to support new product development component debug and product qualification. This team provides career development opportunities in the areas of silicon process understanding, electrical fault isolation thru testing, package and silicon level failure analysis technology, tools, and techniques in semiconductor FPGA products development from design to PRQ (product release qualification).
Responsibilities will include but not be limited to:
Perform hands-on sample prep using polisher, CNC and various equipment for FAFI and silicon debug of Intel's NG products manufactured on advanced packaging and fab process technology.
Develop and derive new Si thinning and IHS removal recipe for NG products.
Perform CNC tool calibration, proliferate Si thinning recipe across products and publish process SOP.
Support FIB sample preparation by LCE (laser chemical etch) technique.
Support advanced package de-processing include delayering and cross section using mechanical, dry, and wet etch techniques.
Logistical support of transporting packaged IC parts between Intel Labs within short distance.
Provide excellent verbal and written communication skills along with operating independently with minimum supervision.
This position is not eligible for Intel immigration sponsorship.
High School Diploma/Equivalent – 8-10 years' experience.
AA/AS: 3 - 6 years.
Experience in LINUX and Microsoft Office (Outlook, Excel, Word, Power Point).
Preferred Qualifications
CMOS-VLSI circuits, electronics, device physics and Fab process flows.
Board/system level testing and problem-solving experience.
ATE/Tester usage experience.
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