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Apple IC Packaging Simulation Engineer United States, California 91004012
06.05.2025
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- Numerical modeling of the stress and deformation of component packages to provide comprehensive understanding of chip-package interaction and package-board interaction to ensure good device yield and reliability.- Programming CAD tools, FEM software, and numerical tools to set up automated model-generation user interfaces and maintain those codes.
- BS and 3+ years of relevant industry experience.
- Proven capability in mechanics and mathematics.
- Hands-on experience of major FEM tools (e.g., ANSYS, ABAQUS, Hypermesh, etc.).
- Proficiency with numerical simulation software tools and expert in MATLAB and/or Scientific Python.
- Deep understanding of packaging materials and their mechanical behaviors.
- Knowledge of electronic packaging structures and processes, as well as its reliability, and package qualification requirements is a huge plus.
- Able to perform independent research and development work.
- Excellent written and verbal communication skills with ability to present ideas, design concepts, data, and plan with high confidence at team meetings.
Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.
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