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Apple IC Packaging Engineer – WLP United States, California 138664216
21.04.2025
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- BS and 3+ years of relevant industry experience.
- We are looking for an individual with experience working in the Semiconductor Packaging field.
- Knowledge of materials characterization and analysis.
- Ideal candidate will have proven understanding of Wafer Level Packaging, 2.5D packaging and 3D packaging technology.
- General understanding of packaging technologies, assembly processes, IC packaging materials, reliability standards, FA techniques, etc.
- Excellent interpersonal skills and has strong business partnership building and collaboration with multi-functional teams and overseas suppliers.
- Ability to work independently and orchestrate projects with minimum supervision.
- Solution-oriented engineer who has proven fundamentals in engineering and physics.
- Shown capabilities using package design softwares, APD, Virtuoso, etc.
- Knowledge of the latest developments in memory packaging.
- Good program management skills.
Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.
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