Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, a related field, or equivalent practical experience.
8 years of experience in product engineering or test engineering.
5 years of experience with industry-standard tools, languages, and methodologies relevant to the development of silicon-based ICs and chips.
Experience with product engineering, supply chain data analytics, diagnostics for High Volume Manufacturing, or NPI.
Preferred qualifications:
Master’s in Electrical Engineering, Computer Engineering, Computer Science, or related field.
12 years of experience in product engineering and test engineering.
Experience evaluating customer returns with ATE and SLT, identifying coverage gaps, developing incremental structural, and functional patterns to address quality issues.
Experience with Statistical analysis (e.g. JMP), Yield Management Systems (e.g., Exensio, YieldExplorer), or Python for data analytics.
Leadership experience delivering HVM screening solutions for high performance computing chips in advanced technology nodes with low DPPM.
Knowledge and experience with industry standards, design tools, DFT best practices, at-speed TDF, ATPG, MBIST, Memory Repair, diagnostic tools, yield improvement.