Broadcom R&D Integration Engineer 

United States, Colorado, Fort Collins 

83776108

Job Description

Roles and Responsibilities

- Hands-on visual, mechanical, and electrical evaluation of wafers. Validation of material to R&D specifications and manufacturing standards using metrology and physical analysis.

- Develop and execute DOEs. Develop and verify root-cause models and solutions.

- Lead technology development from concept to high-volume manufacturing readiness

- May need to research and evaluate new capabilities from vendors and drive the tool selection process.

- Create functional MEMS process flows while balancing competing engineering concerns such as quality, cost, and time.

- View, understand, and create layout artwork.

- Apply understanding of device physics and radio frequency (RF) technology to propose new processes and devices.

- Monitor technology developments in academia and industry

Qualifications

Technical Experience

- MS in EE, ME, Materials science, or related discipline with a minimum of 6+ years of experience in semiconductor/MEMs processing or equivalent or PhD in EE, ME, Materials science, or related discipline with a minimum of 3+ years of experience in semiconductor/MEMs processing or equivalent

- Industrial experience as an integration or development engineer with hands-on expertise required. Candidates withsignificantuniversity cleanroom experience may be considered.

- Experience taking a device idea from initial process conception through high volume production release preferred.

- First-hand experience and expertise with at least one unit process area such as film dep, photo, etch, wafer bond, wet processing, etc.

- First-hand experience and expertise with BEOL processing steps such as metallization, plating, RDL, vias, Cu pillars, wafer bonding

- Comfortable spending time in the cleanroom and physical analysis lab designing, executing, and evaluating experiments.

- Knowledge of and practical experience in statistical analysis and SPC methodology.

- Knowledge of semiconductor processing equipment, vendor roadmaps, and previous experience in working with vendors to deliver necessary process capabilities. Understanding and experience with the hardware, software, control methodologies, and limitations of semiconductor processing equipment.

- Experience designing and implementing novel MEMS components such as microresonators, pressure sensors, accelerometers, or other piezoelectric devices preferred

- RF, FBAR, or BAW experience preferred

Project Management

- Proven ability to manage a technology development program to a schedule.

- Ability to identify critical tasks and secure necessary resources.

- Track record of successful interaction with other functional areas of the organization, such as Procurement, Operations, and Equipment Maintenance.

Personal Attributes

- High level of personal ownership and self-motivation

- Delivery driven. Ability to identify critical tasks and drive prioritization.

- Track record of successful interaction with other functional areas of a manufacturing organization, such as procurement, operations, and equipment maintenance.

- Flexibility to contribute on multiple programs and shifting projects or priorities.

- Desire to work on different technical topics and areas.

Compensation and Benefits

The annual base salary range for this position is $107,000 - $171,000.

This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.