Job Description
The Emerging Packaging and Test Team at Texas Instruments is looking for a Magnetics and Passives Integration Technologist
- Lead the definition, development and realization of comprehensive low-profile inductors, planar magnetics, and integrated passives roadmaps to enable ultra-compact, high-density, high current (100-300A) power delivery modules for enterprise and AI infrastructure
- Develop strategic relationships and partnerships with leading suppliers worldwide to co-develop magnetic materials, inductors, capacitors, and packaging technologies that meet performance, reliability, and scaling needs.
- Ensure manufacturability, testability and reliability through early-stage DfX, material qualification, and close supplier collaboration.
Qualifications
Qualifications:
- MS or PhD in Electrical Engineering, Materials Science, or a related field with deep focus on magnetics and power packaging.
- 10+ years of hands-on experience in power inductor design supporting advanced power topologies, including TLVR & multiphase coupled inductors (upto 20MHz) with a track record of joint development, qualification, and scaling.
- System-level understanding of power delivery architectures, thermal management, EMI, and reliability constraints.
- Strong fundamentals in the physics of magnetic materials: ex. Stoner-Wohlfarth, Steinmetz models, Ollendorf models for composite materials, etc.
- Familiarity with high-frequency magnetic material behavior, loss modeling, and reliability testing. Hands on knowledge of simulation tools and techniques like Maxwell, Ansys, Femtet, homogenization and model order reduction, optimization tools (NN, AI/ML)
- Deep insights in magnetic supplier capabilities, roadmaps and emerging research
- In depth understanding of magnetic materials: Ferrite materials (NiZn MnZn), metal materials (Fe, FeNi, FeSiCr, FeSiAl, amorphous & nano crystalline materials)
- Material Characterization (ex; BH analyzer, VSM, SEM, EDX)
- Understanding of material processing: ceramic, metal powder and composite materials
- Familiarity with inductor coil forming and termination processes: wire wounded, multilayer, metal composite, thin film, etc.
- Experience in advanced co-packaged power modules
- Strong IP generation background in magnetics, packaging, or passive integration domains.
Why TI?
- Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.
- We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours.
- Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us.
If you are interested in this position, please apply to this requisition.
TI does not make recruiting or hiring decisions based on citizenship, immigration status or national origin. However, if TI determines that information access or export control restrictions based upon applicable laws and regulations would prohibit you from working in this position without first obtaining an export license, TI expressly reserves the right not to seek such a license for you and either offer you a different position that does not require an export license or decline to move forward with your employment.
Job Info
- 25002100
- Job CategoryEngineering - Product Dev
- Posting Date19/06/2025, 05:47
- Degree LevelMaster's Degree
- LocationsHIJI 1357 Oaza Oga Hiji-Machi, Oita-Pref, 879-1504, JPTAIC 142, Sec. 1, Hsin Nan Road, New Taipei City, 235, TW
- ECL/GTC Required
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