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Apple Display Module Assembly Packaging Engineer United States, California 68883121
21.04.2025
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- Own overall mechanical and module master specifications from initial concept to mass production, and drive rigorous validation plan to meet performance- Define new display optical package special characteristics based on unique module and system level performance, cost, and footprint requirements. Conduct initial package layout and architecture scoping and sign off the final package design.- Define and develop a MP assembly process. This includes, but not limited to, the initial proof of concept work, novel process, equipment and materials development work, FMEA, process control plan, IQC and OQC, failure analysis, yield analysis and enhancement work.- Identify and assesses critical metrics affecting display performance, analyze experimental and build data, address process limitation, and follow through between modeling and as-built performance- Ability to communicate effectively across the organization, influence other teams, manage risk, make decisions with limited amount of information, deliver against a fast-paced development schedule are key requirements.
- BS with 10+ years of semiconductor packaging/assembly experience
- M.S or Ph.D. in Mechanical Engineering, Physics, Materials Science, Electrical Engineering or similar fields
- Prior optical packaging experience with camera/CMOS image sensor module, LED, photodiode and optical component integrations and system interactions
- Solid fundamentals in electrical/material/thermal/mechanical engineering field
- Familiarity with various sophisticated package configurations and assembly / substrate technology (wirebond, CoWoS, BGA, POP, etc.). Experience with TSV, 2D/2.5D and 3D package connection
- Substrate manufacturing process, structure, design rules and material property
Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.
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