Applied Materials Summer Intern Program Software Engineer 軟體工程師 

Taiwan, Tainan 

822432994

**申請文件 : 提供中英文履歷; 中文自傳(同步提供英文版更加分); 學校成績單; 專業認證證照或作品集。
**收件期間 : 2025/2/1 - 2025/4/15 (面試若符合資格，優先給予錄取通知)。
1.實習期間：2025/7/1-2025/8/31。
2. 實習期間之交通與住宿需自理。
3.實習期間，須全程參與，若無法承諾及配合，請勿投遞。
4.實習尾聲，須提交報告，分享實習成果，方可領取結業證書。並正式納入公司人才庫。
5.工作待遇：大學生月薪台幣42,000元，碩士生月薪台幣48,000元，博士生月薪台幣53,000元。

1. Design and develop feasible solutions in Klayout (free and powerful software developed for chip design engineers).
2. Support software developers to verify component functionality and reliability through laboratory tool testing.
3. Prepare software manual for feature release.
1. Modify limited, polygon sizing/biasing of the global RDL (Redistribution Layer) - Phase
2. Resize or bias RDL layers based on region or angle - Phase 2.
3. Combine Phase 1 and Phase 2 together.
Software testing1. Understand the requirements.
2. Define the test case objective.
3. Identify test scenarios.
4. Write a descriptive test case title.
5. Set preconditions (if any)
6. List the test steps.
7. Define the test results.
Software release1. Learn and understand software release processes and cycles.
2. Prepare functional specifications for test engineers and support engineers.
3. Plan and release new features through user manuals.

Final Review1. The intern will present project in English (30 minutes)

Requirements

Skill: Fluent Englishcommunication/writing/presentation(TOEIC 750+)Knowledge: Computer science, Materials science, Chemical engineering, Electrical engineering, Mechanical engineering or other relevant disciplines.Experience: Analytical skills, research ability, Linux knowledge/experience platform, ability to learn any programming language such as Python.Education (Major/Degree) : Computer Science, Information Science, Electrical engineering or other relevant disciplines.

Full time

Intern / StudentNot Specified