Broadcom DCIM Process Engineer 

United States, Colorado, Fort Collins 

792943056

Semiconductor DCIM Process Engineer

As a DCIM Process Engineer with the Wireless Semiconductor Division (WSD) of Broadcom Inc., you will own, optimize, troubleshoot and develop processes on thin film semiconductor equipment. You will be responsible for establishing robust equipment and processes through rigorous characterization and statistical validation before moving them in high volume manufacturing. You will be involved in supporting both production and R&D teams in a high volume dynamic product mix-manufacturing environment. We are looking to hire a talented, highly motivated engineer responsible for challenging and rewarding work.

Specific Objectives and Responsibilities:

• Work with peers, quality and R&D teams to address safety, quality, yield, reliability, productivity, cycle time, and cost reduction efforts in areas of ownership.
• Responsible for process development of thin film deposition solutions that are stable, well characterized andself-sustainable.
• Respond to process and product deviations to aid on the investigation and solution of potential issues.
• Characterize and document improvements via established methods and systems. Maintain and update documentation for all impacted customers. Use statistical methods to communicate results and drive improvements.
• Work with process development groups and others in manufacturing to ensure tools and processes meet the quality standards.
• Be involved at times in new tool selection, acceptance, and start-up as well as optimization and upgrade work to improve performance on tooling platforms.
• Establish KPI’s and utilize SPC/FDC to monitor performance with robust setups to detect tool deviations and establish preventive maintenance.
• Support Operations team with clear communication of how to support equipment and establish clear documentation.
• Communicate to all levels of the organization as needed progression of work with clear timelines and objectives.

Requirements:

• BS (MS preferred) in EE, ME, ChE, Material Science, Physics or Chemistry.
• 5+ years of experience with wafer process manufacturing equipment process development and troubleshooting in HVM.
• Experience with thin film deposition tools and characterization methods for CVD processes.
• Experience with MEMS devices and interaction between unit processes on device performance a plus.
• Solid understanding of SPC, data driven decision making and able to demonstrate problem-solving skills through controlled documented processes to minimize risk.
• ­­Excellent teamwork, good verbal and written communication skills. Self-motivated, able to organize, coordinate and handle multiple tasks at once and self-prioritize to meet expectations.
• Familiar with statistical methods and software. JMP, Klarity, FDC, Microsoft Suite, etc.
• Attention to detail is essential.
• Legal authorization to work in the U.S. is required

Compensation and Benefits

The annual base salary range for this position is $91,000 - $146,000.

This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.