Broadcom Dry Etch Process Engineer 

United States, Colorado, Fort Collins 

697997005

As an R&D Plasma Etch Engineer with Broadcom Ltd’s Wireless Semiconductor Division (WSD), you’ll develop and sustain new and enabling etch processes in our state of the art MEMS production facilities, located along the beautiful Front Range in Northern Colorado. We’re looking to hire a highly talented & motivated etch engineer to develop and support new and emerging plasma etch MEMS development and manufacture for silicon based micro fabrication technologies.

This position comes with a broad and rewarding set of responsibilities in support of new development, along with existing volume manufacturing. You’ll be looking at new materials and/or applications, exploring new processes, working on optimization, establishing robust processes and rolling new developed processes into high volume manufacturing. You’ll spend time conducting experimental design and data analysis to support process changes, ensuring the identification and resolution of yield and defect issues and communicating results across our organization.

Specific Qualifications and Critical Skills:

• Strong skills and knowledge in Plasma Etch Fundamentals and Manufacturing

  • Ability to mine and leverage etch literature and reference materials to accelerate improvements & development.

  • Develops and maintains well controlled etch processes required to meet the technical requirements of new technology development programs.

  • Strong fundamentals for Statistical Process Control

  • Strong documentation skills for new process development and process improvements.

• Demonstrated Analytical Skills/Problem Solving

  • Knows how to use data to drive robust solutions quickly.

  • Strong experiment design skills: DOE methods and how to rapidly apply DOE learning for development deliverables as well as manufacturing & control improvements.

• Strong Adaptability & Initiative

  • Takes very strong ownership & initiative to identify, define and address issues within their unit process area of responsibility.

  • Able to effectively multitask (with limited, but concurrent high priorities)

  • Passionate about both Manufacturing and Development etch process engineering

  • Strong willingness to learn new skills (especially to self-teach and extrapolate from previous experience and/or leverage from those around them)

• GreatCommunication/Teamwork

  • Ability to exercise strong partnership skills with the broader engineering organization as well as the Operational and Equipment Maintenance groups.

  • Inclined to both mentor new engineers and openly learns from experienced colleagues.

  • Strong ability to work collaboratively and cooperatively with others to deliver results on-target and on-time.

Qualifications:

• BSc in EE, ME, ChE, Materials Science, Physics or Chemistry and 8+ years or related work experience or MSc in EE, ME, ChE, Materials Science, Physics or Chemistry and 6+ years of related work experience.

• Manufacturing experience as a Plasma Etch Engineer.

• Ability to work in a dynamic environment and deliver results.

• Track record of self – motivated learning.

Compensation and Benefits

The annual base salary range for this position is $107,000 - $171,000.

This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.