Intel Advanced Packaging Market Manager United States, Texas 770555758
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The Advanced Packaging Market Manager‘s responsibilities will include but not limited to:
- Drive complex business transactions from deal conception and negotiations to contract closure with companies which positively and significantly impact the business bottom line and/or competitive position.
- Contribute to business strategy development or other strategic projects as appropriate.
- Develop business relationships with third parties to understand the business and technical requirements.
- Work closely with internal development teams to guide business unit platform/product portfolios, accomplishing business unit strategic objectives.
- Conducts industry and market research to make build, buy, or partner recommendations to the leadership team.
- Build the business case to justify potential strategic partnerships and corporate transactions.
- Partners with cross-functional teams, to evaluate and drive strategic thinking on expansion opportunities.
- Identifies opportunities that support strategic priorities by interacting with senior business leaders, software companies, and organic pipeline generation.
- Ability to work independently in a highly matrixed structure.
The Minimum qualifications and are required to be initially considered for this position. Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and / orschoolwork/classes/research.The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications
- Bachelor's degree in Finance, Electrical Engineering, Computer Engineering, Computer Science, Math or in a STEM related field of study.
- 6+ years of experience in microelectronic packaging or related fields.
- 3+ years of experience and interaction with leading Semiconductor players OSAT partners including products packaging trends and/or leading player package roadmaps.
Preferred Qualifications
- Post Graduate in Finance, Electrical Engineering, Computer Engineering, Computer Science, Math or in a STEM related field of study.
- Experience in OSAT-Semiconductor customer interface.
- Experience in packaging disciplines, die prep, assembly, sort, and test technology and manufacturing.
- Experience presenting to Senior Management (VP and Corporate VP Level).
- Experience in supply chain management and/or commercial contracts.
Position of Trust
Weoffer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:
Annual Salary Range for jobs which could be performed in the US:
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