Share
Key Responsibilities
1. For complicated multi discipline features:
Partners with development engineers during development process. Provide risk assessment. Ensure quality per defined specification. Prepares test procedures and work plans for qualification.
Designs and implements methods for Qualifying, testing and evaluating of features as well as full systems and products. Execute qualification and testing procedures.
Analyzes complicated features reports and recommends corrective actions.
2. Lead Integration of sub system:
Responsibility to R&D sub system and system level integration.
Provide integration plans (Tools, HC, work plans).
Leads and executes on and off tool integration.
Provide feedback to R&D on all integration aspects.
Recommend (and sometime lead) corrective actions.
Production documentation: define and qualify full build book and full sub system ATP tests.
3. For system level calibrations and tests:
Provides 3rd level escalation. Focal for field issues. Focal for manufacturing issues.
Developed or take part in developing of (according to PD procedures) calibrations and small system features to improve tool performance, EOU, Maintenance and quality.
4. Collaborate with cross-functional and cross-cultural teamsto develop innovative semiconductor equipment products.
Design and execute experiments, perform testing, and build prototypes to support product development.
Provide technical expertise in diagnosing, troubleshooting, repairing, and debugging complex product issues.
Additional Note
Working environment: 50% in Manufacturing clean room; 50% in office design
Location and Travel Rate: Hsinchu or Tainan. Hsinchu employees need to travel to Tainan by request.
Qualification
5~10 years of hardware experience in Semiconductors, CE is preferred.
Able to do system develop design and trouble-shooting. Canread and understand machine diagrams/schematic menus. Capable of tracing connections between different modules.
English capability: be able to communicate in English
These jobs might be a good fit