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IBM Unit Process Engineer Wafer Bonding United States, New York, City of Albany 723439254
08.05.2024
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IBM Research at Albany Nanotech is seeking engineers in process technology for semiconductors and related devices, including permanent insulator-insulator wafer bonding, hybrid metal/insulator wafer bonding, temporary adhesive wafer bonding, and wafer debonding process. These process technologies are critical for the enablement of applications for 2.5D and 3D integration for chipset-based integrated circuits, backside power delivery network for transistor powering, and stacking of transistors. The hired candidates will have significant expertise and understanding of the fundamental principles in one or more of these process areas. Some of the job responsibilities include maintaining and qualifying state-of-the-art semiconductor 300mm process equipment and/or developing processes from an early concept stage into a mature element that enables a leading-edge technology.
Job responsibilities include:
- As an equipment owner, you will maintain the health of the equipment by collaborating with the equipment vendor, fab operations, process, and management team. To accomplish this, you will use web-based statistical process control charts, SiView to collect the wafer history and related data, and web-based software to analyze the contamination, particle, and elemental data available from the wafers. A good understanding of the measurement and material analytical techniques is preferred.
- As process owner, you are expected to assess the process window, formulate the design of experiments (DOE’s), and make continuous improvements to unstable processes. For process ownership, you will be working with the integration team in addition to the teams mentioned above in (a).
- As a process developer, you are expected to fundamentally understand the process tooling and design experiments to develop new processes for advanced technologies. You will be working with equipment vendors, material vendors, and internally at IBM to drive development for new materials and create data packages for implementation of the developed process. You will be supporting the process needs for a joint development program (JDP) or joint development alliance (JDA).Constant industry research and the ability to be up-to-date with the latest semiconductor equipment advancements are part of this job. The ability and willingness to adapt to changing semiconductor technologies are essential in this position. The generation of intellectual property for IBM and its protection through the patenting process are also expected. The hired candidates must possess strong analytical and design-of-experiment knowledge, excellent written and verbal communication skills in English.
Required Technical and Professional Expertise
1) Bachelor’s degree in a science or engineering discipline
2) Design of experiments
3) Strong communication and presentation skills, Fluent in English
2) Design of experiments
3) Strong communication and presentation skills, Fluent in English
Preferred Technical and Professional Expertise
1) MS/PhD. degree in a science or engineering discipline
2) 1+ year of experience with related experience in wafer bonding and equipment
2) 1+ year of experience with related experience in wafer bonding and equipment
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