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What you'll be doing:
Lead a SI team to drive board/system SI/PI design activities, including PCB stackup/material selection, design guide implementation, layout review, and post-layout analysis
Be both a technical and managerial leader, establish team objectives and ensure SI/PI deliverables
Work closely with Architecture, ASIC, Mixed Signal, Package, and PCB Design teams to design and ensure system SI/PI performance meets expectation before Gerber out, also work closely with Design Validation teams to support SI/PI failure analysis
Develop novel algorithms & new methodologies to improve SI/PI modeling efforts
Work with Application Engineering teams to support customers w/ SI/PI questions
Improve and optimize work procedures, mentor and coach team members
What we need to see:
MS/BS in EE or equivalent experience
8+ years of experience in SI/PI engineering; 3+ years of technical lead/management experience
Deep understanding of electromagnetics, specifically electromagnetic waves including transmission line theory and via properties
Proficient with HFSS, Sigrity, Hspice, and/or other simulation tools
Experienced with Cadence Allegro PCB designer and Constraints Manager
Understanding of high volume manufacturing variations and impact to channel signal integrity
Exposure to lab measurements including VNA & TDR experience
Passionate about SI/PI work; Excellent verbal, written, and communications skills
Ways to stand out from the crowd:
Exposure to interface timing budgets and system modeling
PDN analyses including model generation and time domain simulation
Experience w/ Matlab, Python, and C
Exposure to package design
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