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Intel PBG Advanced Packaging Competitive Lead United States, California, San Jose 706411073
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About the role: As advanced packaging continues to grow in importance, ensuring that PBG can offer leading advanced packaging solutions across 2D, 2.5D/3.5D, and 3D is critical. This role will be responsible for leading the ongoing analysis of the IFS Advanced Packaging roadmap vs external competitive offerings and providing regular updates to both PBG and ATTD management.
The role requires close collaboration with ATTD partners to understand internal offerings and review external research on third-party developments to ensure that PBG creates and maintains an industry-leading portfolio.
Responsibilities include but not limited to:
Work with TD partners to ensure the TD roadmap is aligned with competitor offerings and suggest roadmap adjustments.
Monitor market trends andadvisepackaging strategy adjustments based on market trends.
Partner with Front-End team in IFS to ensure that 2.5D / 3D / 3.5D solutions maximize internal base-die benefits
You mustbelow minimum education requirementsand minimum required qualifications to be initially considered for this position. Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or military experience.preferred qualifications are in addition to therequirements and are considered a plus factor in
Minimum Qualifications:
Bachelor’s Degree with9+ years of experience, OR Master’s Degree with6+ years of experience, ORPHD inComputer Engineering, Electrical Engineering, Physics, Chemistry, or other related field, with 4+ years of experience in semiconductor packaging and customer engagement
2+ years of experience in customer and client services at a senior management level, including regularly providing strategic recommendations to Intel VPs and Corporate VPs, with proventrack recordof effectively presenting insights and proposals to senior management, ensuring alignment with organizational goals,and fostering strong executive relationships.
2+ years of experiencepresenting insights and recommendations to senior management, including VPs and Corporate VPs.
Preferred Qualifications:
nalyzing and integrating key attributes of 2D, 2.5D/3.5D, and 3D architectures from a customer perspective, including benchmarking against external plans and recommending changes to enhance design effectiveness and customer satisfaction.
Master’s degree or PhD degree in Engineering or an MBA.
Evaluating the external packaging landscape andidentifyingkey competitors, enhancing competitive positioning and market strategy.
eveloping and applying mental models of value creation specific to packaging services and products, with a focus on strategic planning and execution.
Position of Trust
Weoffer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:
Annual Salary Range for jobs which could be performed in the US:
This role is available as a fully home-based and generally would require you to attend Intel sites only occasionally based on business need. This role may also be available as our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change. The application window for this job posting is expected to end by 04/04/2025
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