IBM Semiconductor Package Design Technical Lead 

India, Karnataka, Bengaluru 

705032443

Responsibilities

• The Tech Lead Engineer is responsible for delivering packages that meet functionality, performance, and cost objectives.
• Included in this role is to work with stakeholders in a multidisciplinary team to define requirements and develop package design solution for next generation systems.
• Some of these cross-disciplinary work includes but not limited to:
  • Work with chip and system architects to define high-speed bus requirement, pervasive/test signal requirements and voltage rail requirements.
  • Work with chip team to co-develop chip floor planning and the C4 footprint.
  • Work with signal integrity team to develop high-speed bus routing rules to meet the SI performance objectives.
  • Work with power integrity team to find decoupling solution to meet the PI requirements.
  • Work with package physical design team to ensure laminate design meets expected requirements.
  • Work with package technology and qualification team to ensure the package reliability standard.
  • Work with socket team to ensure the availability of socket technology for electrical and mechanical standard.
  • Work with system team to ensure the package is compatible with system’s thermal and mechanical capability.
  • Work with test team to develop technical requirements that effective supports a test strategy.
  • Work with program manager to coordinate plans and schedules.
• As a core member of the Package team, you will be expected to work autonomously and deliver on project phases on time and on budget. We will help you achieve your goals by continuous professional development and regular career progression sessions.

Required Technical and Professional Expertise

• Bachelor of Engineering – Electrical or Electronics
• 10+ years System Design and/or Packaging Experience
• Technical skills:
  • Demonstrated experience in FC PLGA/PBGA package design in a system setting.
  • Understanding of package design process from concept-to-completion, organic package substrate technology and qualification.
  • Demonstrate knowledge of signal integrity, power integrity for high-frequency and high-power package applications.
  • Experience using package design/editor tools, for example, Cadence Allegro Package Designer (APD).
• Inter-personal skills:
  • In addition to demonstrated technical knowledge, the ideal candidate should demonstrate interpersonal communication, creative problem solving, and team building skills.
  • Candidate must be able to identify issues, develop and execute action plans, and react quickly to changing requirements.
  • Strong communication skills, with the ability to lead a cross functional Development team.

Preferred Technical and Professional Expertise

• PhD Electrical Engineering
• Expert in the Development of Computer Enterprise Server Systems
• Experience in program management in a highly dynamic cross-functional environment.
• Expert in organic package design and qualification.
• Deep level of understanding in multiple disciplines including thermal, mechanical design, signal and power integrity, power delivery, and physical design.