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IBM Semiconductor Package & System Planning Engineer 
India, Karnataka, Bengaluru 
311976899

26.06.2024

This position involves end to end ownership of the server logical/physical planning development. The right candidate will have the opportunity to drive industry leading technology and work with a team of world class experts in the field of system, package, and PCB technology. Responsibilities for this role span from inception/concept creation, to implementation, and field support throughout the products’ lifecycle.

This Package Team is currently looking to fill a position that requires strong fundamentals in System-in-Package (SiP) design, signal and power integrity, and package technology, pc board layout with a high level of analysis and design skills. Ideal candidate will show independence and the ability to be a self-starter.

Responsibilities

  • Work with stakeholders and others in a multidisciplinary team to define requirements and develop the system solution for next generation enterprise server systems.
  • Responsible for defining new component pinout definition, system logic, logic to card partitioning, card area analysis for required component fit, and route ability for the design.
  • Must ensure design is released on schedule to meet project milestones.
  • Included in this role is development of new components, pinouts, and routing plans that are compatible within multiple system designs.
  • As a core member of the team, you will be expected to work autonomously and deliver designs on time and on budget.
  • We encourage you to continuously develop your skills to meet dynamic changes in the industry


Required Technical and Professional Expertise

  • Bachelor of Engineering in Electrical or Electronics
  • 5+ years System Design and/or Packaging Experience
  • Familiarity with logic entry, PCB design tools (ex: Cadence: Concept, ASA, and Allegro), signal and power integrity.
  • Demonstrated experience in complex system design using high speed busses. (PCIE, DDR5)
  • Demonstrated communication skills in a cross functional Development team environment.
  • Understanding of Development process from system concept to product qualification.
  • Experience with creating physical symbols, PCB routing and system timing.
  • Work with team members to review system schematics and physical designs.
  • Candidate should demonstrate interpersonal communication (including verbal and written communication), creative problem solving, time management, and team building skills.
  • Candidate must be able to identify layout problems and offer creative solutions.
  • Ability to develop and execute action plans and react quickly to changing requirements.
  • Basic programming and scripting experience (writing and/or modifying Perl, Python, Skill, spread sheets) highly desired.
  • Experience with I2C, PCIE GEN5, DDR5, and high-speed busses.
  • Deep knowledge in Microsoft Excel and spreadsheet manipulation/automation.


Preferred Technical and Professional Expertise

  • Master’s in engineering – Electrical or Electronics
  • Experience in system Design Development
  • Exposure to Development of Computer Enterprise Server Systems
  • A background and experience in component pinout design is a plus.

ADDITIONAL INFO

  • Describe your experience with card or substrate design. What electrical and physical constraints might you have when designing a PCB?
  • What (if any) experience do you have working with Excel, Skill, Perl, Python and/or JavaScript? Describe the function or problem that you solved using through writing these programs.
  • Do you like solving complex problems? Please give some examples.
  • Do you have any PCB or card or module layout experience?
  • What layout tools have you use if any? (Example: Cadence, Mentor Graphics, OrCAD
  • Do you have any quality control experience?
  • Do you prefer to work alone on a project or with a team. Explain why.
  • What would you do if you had an extremely complex problems that needed to be solved in a short period of time.
  • Describe your experience with high-speed busses for PCB design.
  • Describe what difficulties you have encounter with the designs and techniques used to solve the problems.
  • Describe your experience with PCIE gen5 PCB card design.