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Execute Reject validation and Engineering Data Collection with ATE platform .
Equip with ATE test platform operation knowledge as well as test program flow architecture.
Drives failure identification in processes and products and searches for improvements to enhance yield, performance, quality, and reliability of next generation product and package technologies.
Collaborates with design and process development engineers to determine relationship of materials properties and electrical performance and thoroughly explains fundamental aspects of material and device interactions as needed to assist in the transfer new product to manufacturing.
Adds to the development of electrical, analytical, and mechanical methodologies by developing failure mode and effects analysis (FMEA) and maintaining control plans throughout the product lifecycle.
Applies strategic failure analysis capabilities for future technologies and products, drives automation and improvement of failure analysis process, and conducts innovative use of new analytical tools, equipment, and methodologies.
Develops, records, and performs failure analysis on systems and components to identify root cause, analyze failure reports, and recommend corrective action to prevent reoccurrence of problems.
At least more than 2 years of experience
Good knowledge in one or more of these areas:
Device physics, I/O structure,
Microprocessor architecture and micro architecture, microprocessor circuit, circuit analysis and DFT/DFD architecture, layout
Perl/Python/C programming/assembly language
Wafer fabrication process (added advantage)
Excellent verbal and written communication skills
Ability to work well in a diverse team environment, excellent teamwork and a positive mindset
Strong problem solving and analytical skills
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