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Apple Asia IC Packaging Engineer United States, Washington, Tacoma 67892872
15.06.2024
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Description
- Explore and evaluate packaging technologies as our own packaging tool box. Define new package characteristics and specification based on unique module and system level performance, cost, and footprint. - Work with leading foundry & assembly suppliers on advanced organic and silicon interposer interconnect package development from design, new material, new equipment selection and establish robust process/process flow. Perform initial proof of concept sample build, process of record, package and process qualification, reliability test, yield analysis and continuous improvement. - Define packaging roadmap based on long term packaged product requirements. Work closely and manage suppliers’ R&D activities.
Minimum Qualifications
- M.S or above degree in mechanical engineering, physics, materials science or equivalent with a minimum of 5 years of experience in IC packaging.
- In-depth knowledge in chiplet integration, RDL fanout and CoW technologies.
Preferred Qualifications
- Good understanding to WoW, Silicon photonics, HBM integration.
- Knowledge in silicon node BEOL and device physics or component/board level reliability testing are plus.
- Proven track record to drive issue resolution with good understanding to root cause and physics, motivate and mobilize all levels within supplier to accomplish any given task. Able to perform independent research and development work with minimal supervision.
- Good written and verbal communication skills. Able to present ideas, design concepts, data and plan with high confidence at internal or external meetings.
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