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Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.Minimum Qualifications:
Bachelor's / Master's Degree in Electrical Engineering with 8+ years of relevant industry experience.
Proven experience on package and board level signal integrity analysis.
Signal Integrity experience supporting high-speed/low-speed signals such as PCIe, Ethernet, Display, CSI.
Fundamental knowledge of transmission line theory and high-speed/low speed Printed Circuit Boards (PCB) design
Experience with SI modeling and analysis tools, including HSPICE, ADS and EM simulations tools like PowerSI, SIwave, HFSS or other similar design tools. Knowledge of 2D/3D modelling techniques.
Ability to communicate effectively across multiple disciplines, such as silicon design, package design, board design, PCB layout, and mechanical design.
Great team player, willing to learn and flexible.
Ability to lead a small group of simulation engineers through the design process of a complex SoC till achieving tape in
Preferred Qualifications:
Power integrity experience or knowledge will be added advantage.
Automotive domain experience will be added advantage.
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