Expoint - all jobs in one place

מציאת משרת הייטק בחברות הטובות ביותר מעולם לא הייתה קלה יותר

Limitless High-tech career opportunities - Expoint

Intel Signal Integrity Engineer Automotive 
India, Karnataka, Bengaluru 
660129126

14.08.2024

Roles and Responsibilities- Deliver signal integrity solutions for automotive segment package, platform.
- Develops a viable space for all interconnects, including 2D and 3D model extracts of electrical structures for the entire die to die interconnect.
- Defines signal integrity rules, reviews implementation, documents characterization, and measurement reports, and improves and optimizes design margins.
- Applies knowledge of signal integrity design and tradeoffs to perform simulations of interconnect and guide package and platform physical implementation.
- Designs and characterizes test structures to correlate simulations and measurements for interconnects using intricate high-speed equipment and debugs challenges.- Collaborates with IP design teams and silicon integration teams to ensure the IP and SoC designs maximize the platform-level solution space to meet targeted product landing zone requirements and minimize quality degradation (e.g., attenuation, crosstalk, jitter, power noise) and cost.

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.Minimum Qualifications:
Bachelor's / Master's Degree in Electrical Engineering with 8+ years of relevant industry experience.
Proven experience on package and board level signal integrity analysis.
Signal Integrity experience supporting high-speed/low-speed signals such as PCIe, Ethernet, Display, CSI.
Fundamental knowledge of transmission line theory and high-speed/low speed Printed Circuit Boards (PCB) design
Experience with SI modeling and analysis tools, including HSPICE, ADS and EM simulations tools like PowerSI, SIwave, HFSS or other similar design tools. Knowledge of 2D/3D modelling techniques.
Ability to communicate effectively across multiple disciplines, such as silicon design, package design, board design, PCB layout, and mechanical design.
Great team player, willing to learn and flexible.

Ability to lead a small group of simulation engineers through the design process of a complex SoC till achieving tape in
Preferred Qualifications:
Power integrity experience or knowledge will be added advantage.
Automotive domain experience will be added advantage.

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits