High-speed link modeling and simulation, including high-speed I/O, IC package,e and system interconnections.
Modeling and analyzing power delivery networks.
Electromagnetic modeling of complex 3-dimensional structures.
Perform pre- and post-route signal integrity analysis of both PCB and ASIC package designs.
Write signal integrity design guidelines, test plan, and test report.
Decide appropriate PCB material, stack-up, and work with vendors to address any DFM issues.
Support prototype function bring-up, validation, and troubleshooting.
Address signal integrity challenges on system high-speed interconnections, clock, power, etc.
Work closely with other hardware function teams including HW design, eCAD, Mechanical, Power, EMC, and Diag to deliver first-class products.
Strong tools knowledge with tools such as HFSS, ADS, Matlab, Cadence PowerSI/DC, Allegro, Simbeor, and HSpice.
Proficiency with 3-D field solvers and PI (Power Integrity) simulation tools such as PowerSI/DC.
Self-motivation, collaboration, strong communication, and a desire to innovate are important.
Working experience with high-speed NRZ and PAM4 SerDes, as well as high-speed PCB/package development and PI analysis, is a plus.
Masters or PhD in Electrical Engineering
Knowledge of optical transceiver module types, form factors, and requirements.