Intel Advanced Packaging Flagship Curriculum Internship Program 

Malaysia, Kedah 

628662409

Responsibilities and scopes may be quite diverse depending on the function or project assigned. The industrial exposure and technical skill learned will enhance the students knowledge and experience for their future career undertaking.This internship is only open for the undergraduate student who has taken the Advanced Packaging Flagship Curriculum and required to undergo the internship program by USM academic plan.Student / InternShift 1 (Malaysia)Malaysia, Kulim

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.