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Google Physical Product Design Lead Platforms Infrastructure United States, California, Sunnyvale 623899502
18.09.2024
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Minimum qualifications:
Preferred qualifications:
- Bachelor's Degree in Mechanical Engineering, Product Design, or equivalent practical experience.
- 8 years of experience in design and analysis of electro-mechanical systems and products.
- Experience in Chip Package Interaction (CPI), packaging materials, process, thermal, and package design.
- Experience in technical leadership and innovation.
Preferred qualifications:
- PhD in Engineering or a related field.
- Experience with 2.5D silicon interposer and silicon bridge technologies.
- Experience in designing and analyzing structural engineering fundamentals and material properties/science. Experience in designing complex electro-mechanical assemblies, mechanical tolerances, and tolerance analysis.
- Experience in designing and analyzing thermal engineering fundamentals with heat transfer and fluid dynamics, with applications towards Machine Learning (ML) Liquid cooling systems.
- Knowledge of multidisciplinary interactions between chip/packaging technology, board and rack system.
- Ability to communicate, develop innovative product solutions, and collaborate globally.
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