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Broadcom Assembly Process & NPI Engineer Singapore, Singapore 578943950
17.12.2024
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Description:
You are responsible to drive and manage the silicon Bump &package assemblysuppliers, backend processes and solutions to achieve the aggressive TQRDCEB goals. You will work closely withpackage design & technology,, production planning, quality& NPI. Plan, driveimplement improvement activities for continual improvement,sourcing, cost
Qualifications:
PhD / Master/ Degree in Mechanical / Electrical / Electronics Engineering withyears of relevant experience of managing advanced node silicon bumping, large body single & multi-chip (2.1/2.5/3D) package assembly, substrate & back-end suppliers and processes.
Hands on experience in Product Life-Cycle Management - creating & maintaining Bill of Material structure, Process Documentation, Process Change Notification etc.
Sound knowledge of applicable industry standards, quality systems, regulations, knowledge of prevailing and emerging silicon package & substrate technologies, bumping and assembly processes, materials and equipment.
Able to communicate with internal team members & external partners in various geographic locations and may required to travel from time to time at short notice.
Experienced AutoCAD user. Knowledge of silicon & PCB fabrication, board assemblyprocesses, are an added advantage
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