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Nvidia Senior Failure Analysis Engineer 
United States, California 
506591942

24.06.2024

What you’ll be doing:

  • Perform and coordinate both Electrical and Physical Failure Analysis efforts to assist in product development, design debug, yield improvement, final test, quality, reliability, and customer returns on various NVIDIA products, including semiconductor ICs, boards, and systems.

  • Utilize advanced EFA principles and operate EFA tools such as Curve Tracer, Emission-based analytical tools, Laser Scanning Microscopy, and imaging tools (3D Xray, CSAM, etc.) for fault isolation and analysis.

  • Communicate effectively EFA fault isolation findings and provide timely assistance to PFA teams (in-house or foundry and assembly partners) to root cause the problems.

  • Collaborate closely with Product Engineering and Test Engineering teams to verify and duplicate failures modes of failures that are reported on ATE, SLT, and appropriate test setups.

  • Drive continuous improvement initiatives to enhance production test program quality and efficiency.

  • Actively participate in cross-functional teams to efficiently debug product failures and implement optimal solutions.

  • Write and maintain scripts and tools for the test engineering groups to enhance overall productivity and effectiveness.

What we need to see:

  • Master's degree or higher in electronics or related engineering fields (or equivalent experience).

  • 8-10 years of relevant experience in Failure Analysis or related fields.

  • Proficiency in basic electrical engineering and testing, transistor device physics, silicon device physical failure analysis, advanced CMOSmanufacturing/processes,circuit analysis, and automated test equipment (ATE).

  • Ability to understand and/or operate Physical Failure Analysis tools for silicon inspection, cross-section, delayering, material analysis (Scanning Electron Microscope, Focused Ion Beam, Nanoprobing, etc.) is a plus.

  • Strong written and verbal communication skills, with the ability to participate effectively in dynamic teams.

Ways to stand out from the crowd:

  • Demonstrate proficiency in advanced backside analysis techniques and use of state-of-the-art analytical instruments.

  • Showcase experience in analog circuit design, PLLs, and system-level testing/validation.

  • Highlight knowledge of active thermal management and product engineering experience, such as yield analysis and defect analysis.

  • Display familiarity with Linux operating systems/shell scripting and programming languages such as Python/Perl and/or C/C++.

You will also be eligible for equity and .