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FI/FA Engineersresponsibilitiesinclude (but are not limited to):
Review incoming support requests and determine initial failure analysis / fault isolation workflow to identify & visualize root cause.
Hands on operation of laboratory equipment, such as curve tracing, photon emission microscopy, laser stimulation (OBIRCH), and infrared imaging systems.
Conduct failure analysis workflows using Ga & plasma FIBs, nanoprobing and sample preparation equipment. Mentor and coordinate workflows with supporting technicians.
Interact with Transmission Electron Imaging (TEM) experts to interpret and explain failure root cause.
Support continual improvement & development of new workstreams & techniques.
Develop a thorough understanding of upstream and downstream techniques in the lab and work seamlessly with peers of different disciplines to get high quality results with fast throughput time.
Present results of key analyses to internal and external customers.
Candidate should have the following
behavioral skills:
Demonstrated strength in teamwork, analytical problem solving, and effective oral and written communication skills.
Inquisitive, desire to learn and expand knowledge in field.
Ability to work with multi-functional, multi-cultural teams.
Strong in decision making and problem solving.
Minimum Qualifications:
Bachelor's degree in science and engineering major.
2+ years' experience in a semiconductor failure analysis laboratory.
Preferred Qualifications:
Advanced degree (Master's or Ph.D.) in science and engineering major.
4+ years’ experience in a semiconductor failure analysis laboratory supporting advanced technology node technology development.
4+ years’ experience with 6T SRAM & logic failure analysis.
Experience operating fault isolation & failure analysis tools.
Understanding of FinFET technology architecture.
Knowledge of wafer fabrication and general microelectronics.
Knowledge of electrical and physical failure analysis flows for semiconductor.
Hands on experience operating laboratory equipment.
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