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Google Packaging Engineer Custom Silicon Operation Taiwan, New Taipei 505038991
25.09.2024
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Minimum qualifications:
- Bachelor's degree in a technical field, or equivalent practical experience.
- 5 years of experience in program management.
- 5 years of experience as a Semiconductor Packaging Engineer.
- Experience in packaging technologies, assembly processes, Integrated Circuit (IC) packaging materials, reliability standards, Failure Analysis (FA) techniques.
- Experience in leading cross-functional teams.
- Ability to travel as required.
Preferred qualifications:
- Master's degree or PhD in Electrical Engineering, Computer Engineering or Material Engineering or a related field.
- Experience with SoC and Power Management Integrated Circuit (PMIC) productization.
- Experience in data analysis using semiconductor production data.
- Understanding of Wafer Level Packaging, 2.5D packaging and 3D packaging technology.
- Ability to work in a fluid environment.
- Excellent written and verbal communication skills.
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