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Google Silicon Package Signal Integrity/Power Integrity Engineer 
Israel, Haifa District, Haifa 
487157383

10.04.2025
Info Note: By applying to this position you will have an opportunity to share your preferred working location from the following: Haifa, Israel; Tel Aviv, Israel.Note: By applying to this position you will have an opportunity to share your preferred working location from the following:.
Minimum qualifications:
  • Bachelor's degree Electrical Engineering or related field, or equivalent practical experience.
  • 2 years of experience with IC package design for high speed/power ICs such as CPUs, GPUs/ASIC/Chipset.
  • Experience in Signal Integrity/Power Integrity design for all level interconnections including chip, package and PCB level.
  • Experience in full system power analysis including silicon and package interconnect.

Preferred qualifications:
  • Master's degree in Electrical Engineering or equivalent practical experience.
  • Experience in electrical characterization of one or more of the following interfaces (e.g., PLL, SERDES, DDR4\5).