Amazon Signal Power integrity engineer IC package 

Israel, Haifa District, Haifa 

330084020

This position is for an experienced engineer with strong background in high-speed electrical interfaces, such as DRAM, PCIe, Ethernet SerDeses.
The line of work is multi-disciplinary, combining Package-Design, Back-End integration of electrical IPs, SI/PI extractions & simulations.Key job responsibilities
As a SIP team member, you will assume responsibility for all electrical aspects of physical interfaces of advanced I/Os, PLL, Memory and SerDes interfaces, from integration at the Die level, through SI/PI simulation and package layout, to reference board design aspects.
The scope of your work will include:
• Deep dive into electrical IPs, integrated into the DIE;
• I/O ring design and close work with Backend team on floor-planning all I/O interfaces at the DIE level.
• Lead test studies of Die bump-out arrangements and Package substrate breakout.
• Lead layout test studies of package pin-out arrangements and PCB board breakout.
• Design large and complex package substrates.
• Carry advanced SI/PI extractions and simulations to validate the design from the silicon to the peer device at the board level.About the team
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- Knowledge of Chip, Package and PCB co-design methodology.
- Knowledge in high-speed digital interfaces such as DRAM/PCIe/SerDes.
- Knowledge in power-integrity and power-delivery of low-voltage high-current – an advantage
- Hands on experience with lab testing and characterization – an advantage.
- Familiarity with simulation/extraction tools (e.g. HFSS, Sigrity, HSpice) - an advantage