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Google Advanced Manufacturing Engineer Metallurgy Google Cloud Taiwan, Taipei, Taipei 481153951
20.11.2024
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Minimum qualifications:
- Bachelor's degree in Electrical, Mechanical, Chemical, or equivalent practical experience.
- 10 years of experience in manufacturing, or process development in semiconductor packaging and SMT.
- Experience in advanced IC packaging qualifications, metallurgy, thermal dynamics, and Design of Experiments.
- Experience in microstructure, material characterization, solder alloy, Indium, and Copper interconnect long-term reliability.
Preferred qualifications:
- Master's degree in Electrical, Mechanical, Chemical, or related disciplines.
- Understanding of industry trends, emerging technologies, and competitive dynamics within the field of solder alloys and STIMs.
- Demonstrated record of delivering robust innovative manufacturing solutions, leading failure analysis investigations and resolutions, and overseeing yield improvements for high complexity products.
- Expertise in designing and conducting experiments to evaluate material properties, performance, reliability, and compatibility with various packaging substrates and components.
- Excellent communication and investigative skills, able to collaborate with multi-geo teams on complex projects spanning multiple technologies.
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