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Google Package Thermal Mechanical Engineer United States, California, Sunnyvale 46699018
14.08.2024
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Minimum qualifications:
Preferred qualifications:
- Bachelor's degree in Mechanical, Material, Electrical Engineering, Technology, Science, a related field, or equivalent practical experience.
- 3 years of experience in thermal analysis of semiconductor chips and packages.
- Experience in CFD and thermal analysis software such as: FloTherm, Fluent, Icepak, Simulia, or Comsol.
- Experience in structural analysis software such as: Ansys Mechanical or Abaqus.
Preferred qualifications:
- PhD.
- Experience in advanced semiconductor device modeling (including multi-chip assemblies and 2.5D/3D) and co-optimize chip physical layout.
- Experience working with cross-functional teams for co-design across chip, package, and system levels.
- Knowledge of capturing failure modes through simulation and estimating product lifetime.
- Familiarity with JEDEC thermal standards.
- Advanced proficiency in applying scripts to automate thermal and mechanical simulations.
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