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Google Package Thermal Mechanical Engineer 
United States, California, Sunnyvale 
370757784

05.08.2024
Minimum qualifications:
  • Bachelor's degree in Mechanical, Material, Electrical Engineering, Technology, Science, a related field, or equivalent practical experience.
  • 3 years of experience in thermal analysis of semiconductor chips and packages.
  • Experience in CFD and thermal analysis software such as: FloTherm, Fluent, Icepak, Simulia, or Comsol.
  • Experience in structural analysis software such as: Ansys Mechanical or Abaqus.

Preferred qualifications:
  • PhD.
  • Experience in advanced semiconductor device modeling (including multi-chip assemblies and 2.5D/3D) and co-optimize chip physical layout.
  • Experience working with cross-functional teams for co-design across chip, package, and system levels.
  • Knowledge of capturing failure modes through simulation and estimating product lifetime.
  • Familiarity with JEDEC thermal standards.
  • Advanced proficiency in applying scripts to automate thermal and mechanical simulations.