Intel FE Process Integration Engineer 

United States, Arizona, Phoenix 

432006217

Job Description:

In alignment with Intel's IDM2.0 strategy, FSM is expanding operations to meet the demands of both internal and foundry customers, introducing state-of-the-art technologies into high-volume manufacturing.

This job requisition seeks Front-End-Of-Line (FEOL) Process Integration engineers for the HVM Global Yield organization, reporting to the FEOL Process Integration manager.

FEOL (Front-End-Of-Line) Integration Development Engineers are responsible for:

• Leading engineering projects to execute high-volume manufacturing (HVM) yield roadmaps and achieve performance targets.
• Collaborating with Technology Development and Local Yield teams to implement new technologies in production fabs.
• Working with FEOL/BEOL Integration, Device, Defect Reduction, and Yield Analysis teams to identify root causes of yield and performance issues and executing mitigation plans within set timelines.
• Conducting feasibility studies and experiments to characterize processes and enhance product performance throughout development.
• Managing New Product Introductions (NPI) in production fabs and optimizing processes to meet foundry customer specifications.
• Partnering with Local Yield teams to improve product yield, quality, performance, and reduce wafer costs.

Qualifications:

Minimum Qualifications:

• Bachelor's degree in a relevant science or engineering field, with at least 3 years of semiconductor industry experience.
• Experience in advanced node semiconductor industry, specifically in FEOL Process Integration
• Proficient understanding of Device Physics, with experience in FinFET or Gate-All-Around technology development or high-volumemanufacturing.
• Familiarity with module processes such as lithography, dry etch, wet etch, CMP, diffusion, implant, thin films, and metrology.
• Level of experience will be considered in determining applicants jobgrade.

Preferred Qualifications:

• Advanced degree (Master's or Ph.D.) in Electrical Engineering, Physics, or Materials Science; related fields may be considered based on industryexperience.
• Experience in project/program management and/or as a TFTlead.
• Strong interpersonal skills, including the ability to influence and motivateothers.
• Experience engaging with external foundry customers through technicalinteractions.
• Familiarity with GAA (Gate-All-Around) technologyarchitecture.
• Background in new semiconductor technology development.
• Strong problem-solving skills, self-initiative, and ability to learnindependently.
• Ability to collaborate effectively with multi-functional and multi-cultural teams.
• Excellent communication skills.

Experienced HireShift 1 (United States of America)US, Arizona, Phoenix
Position of Trust

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This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.