Nvidia Senior Electro-Optical Packaging Lab Practical Engineer 

Israel, North District 

425753967

What you’ll be doing:

• Participating in development of new packaging technologies while working tightly with process development team.

• Prepare and conduct experiments to test new assembly technologies and materials.

• Operation and maintenance of variety of platforms involved in process of packaging - WireBonding/Pick&Place/ActiveAlignment.

• Maintain laboratory hardware and handle materials.

What we need to see:

• Electrical/MechanicalPractical Engineer diploma.

• 5+ years experience in manufacturing environment - microelectronics or packaging.

• Operator level on machines involved in packaging process -Pick&Place/flip Chips/BGA/Wire Bonding.

• Good attention to detail, as well as clear written and verbal communications.

Ways to stand out from the crowd:

• Previous experience in Optical packaging production line.

• Demonstrated hands-on experience in two of three leading packaging platforms - WireBonding/Pick&Place/ActiveAlignment.

• Previous experience as Engineering Technician in semi-conductor industry.