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Nvidia Senior Electro-Optical Packaging Lab Practical Engineer 
Israel, North District 
425753967

31.07.2024

What you’ll be doing:

  • Participating in development of new packaging technologies while working tightly with process development team.

  • Prepare and conduct experiments to test new assembly technologies and materials.

  • Operation and maintenance of variety of platforms involved in process of packaging - WireBonding/Pick&Place/ActiveAlignment.

  • Maintain laboratory hardware and handle materials.

What we need to see:

  • Electrical/MechanicalPractical Engineer diploma.

  • 5+ years experience in manufacturing environment - microelectronics or packaging.

  • Operator level on machines involved in packaging process -Pick&Place/flip Chips/BGA/Wire Bonding.

  • Good attention to detail, as well as clear written and verbal communications.

Ways to stand out from the crowd:

  • Previous experience in Optical packaging production line.

  • Demonstrated hands-on experience in two of three leading packaging platforms - WireBonding/Pick&Place/ActiveAlignment.

  • Previous experience as Engineering Technician in semi-conductor industry.