Western Digital Process Engineer Die Preparation 

Japan, Kyoto 

34245280

Today’s exceptional challenges require your unique skills. It’s You & Western Digital. Together, we’re the next BIG thing in data.

• Yield Management: Oversee overall yield management for specific products, covering both assembly and test processes to ensure optimal performance and quality.
• Commonality Analysis: Coordinate cross-functional teams to perform commonality analysis by product design, process, machine, material, and measurement to identify root causes of issues and develop effective improvement plans.
• Engineering DOEs and Statistical Analysis: Conduct Design of Experiments (DOEs) and apply statistical analysis methods to solve complex problems, making data-driven decisions.
• Process Setup and Improvement: Set up and continuously improve assembly processes, specifically focusing on die preparation. Ensure familiarity with die preparation equipment such as Disco Sawing, Back grind, Laser, and DDS processes.
• Excursion and Abnormal Case Management: Manage production line excursions and abnormal cases, ensuring swift and effective resolution.
• Cost Reduction Projects: Follow up on and implement engineering value (cost reduction) projects to enhance efficiency and reduce expenses.
• Capacity and Productivity Improvement: Continuously improve production capacity and productivity through innovative solutions and process optimizations.
• Process Assessment and Optimization: Oversee and assess existing processes and workflows, designing, implementing, and testing new procedures to optimize productivity.
• Reporting and Documentation: Assemble detailed reports to document process status, changes, and improvements, ensuring clear communication of findings and proposals to upper management.
• Metrics Tracking: Track key metrics to identify areas for improvement and monitor the effectiveness of upgrades and changes.
• Simulation and Testing: Utilize process simulation software to test and identify the most appropriate production strategies.
• Implementation of Changes: Provide thorough instructions and support for the successful implementation of process changes.
• Risk Assessments: Conduct risk assessments to identify potential issues and mitigate risks effectively.
• Compliance Assessment: Ensure compliance with applicable safety and quality standards.
• Departmental Contribution: Contribute to departmental efforts by accomplishing related tasks as needed to support overall goals.

• Bachelor’s degree in Engineering or a related field.
• Proven experience in die preparation processes within the semiconductor industry.
• Strong knowledge of die preparation equipment (e.g., Disco Sawing, Back grind, Laser, DDS).
• Proficiency in statistical analysis and process simulation software.
• Excellent problem-solving skills and the ability to make data-driven decisions.
• Strong communication and coordination skills to work effectively with cross-functional teams.
• Detail-oriented with a focus on continuous improvement and optimization.
• Strong attention to detail.