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Western Digital Process Engineer Die Preparation 
Japan, Kyoto 
34245280

14.08.2024
Company Description

Today’s exceptional challenges require your unique skills. It’s You & Western Digital. Together, we’re the next BIG thing in data.

Job Description
  • Yield Management: Oversee overall yield management for specific products, covering both assembly and test processes to ensure optimal performance and quality.
  • Commonality Analysis: Coordinate cross-functional teams to perform commonality analysis by product design, process, machine, material, and measurement to identify root causes of issues and develop effective improvement plans.
  • Engineering DOEs and Statistical Analysis: Conduct Design of Experiments (DOEs) and apply statistical analysis methods to solve complex problems, making data-driven decisions.
  • Process Setup and Improvement: Set up and continuously improve assembly processes, specifically focusing on die preparation. Ensure familiarity with die preparation equipment such as Disco Sawing, Back grind, Laser, and DDS processes.
  • Excursion and Abnormal Case Management: Manage production line excursions and abnormal cases, ensuring swift and effective resolution.
  • Cost Reduction Projects: Follow up on and implement engineering value (cost reduction) projects to enhance efficiency and reduce expenses.
  • Capacity and Productivity Improvement: Continuously improve production capacity and productivity through innovative solutions and process optimizations.
  • Process Assessment and Optimization: Oversee and assess existing processes and workflows, designing, implementing, and testing new procedures to optimize productivity.
  • Reporting and Documentation: Assemble detailed reports to document process status, changes, and improvements, ensuring clear communication of findings and proposals to upper management.
  • Metrics Tracking: Track key metrics to identify areas for improvement and monitor the effectiveness of upgrades and changes.
  • Simulation and Testing: Utilize process simulation software to test and identify the most appropriate production strategies.
  • Implementation of Changes: Provide thorough instructions and support for the successful implementation of process changes.
  • Risk Assessments: Conduct risk assessments to identify potential issues and mitigate risks effectively.
  • Compliance Assessment: Ensure compliance with applicable safety and quality standards.
  • Departmental Contribution: Contribute to departmental efforts by accomplishing related tasks as needed to support overall goals.
Qualifications
  • Bachelor’s degree in Engineering or a related field.
  • Proven experience in die preparation processes within the semiconductor industry.
  • Strong knowledge of die preparation equipment (e.g., Disco Sawing, Back grind, Laser, DDS).
  • Proficiency in statistical analysis and process simulation software.
  • Excellent problem-solving skills and the ability to make data-driven decisions.
  • Strong communication and coordination skills to work effectively with cross-functional teams.
  • Detail-oriented with a focus on continuous improvement and optimization.
  • Strong attention to detail.