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ARM Package Design Engineer 
United States, California, San Jose 
340782003

11.03.2025

Responsibilities:

The Package design engineer will be in charge of drawing novel System-in-Package designs. State of the art power delivery techniques and interfaces will be key in emerging technologies as advanced packaging is growing in industry importance.

This role will be a critical element of technology development, so the ability to work with loosely defined problems and adapt to changes is important.

Required Skills and Experience:

· Engineering degree or equivalent

· 5 or more years of experience in package design

· Use an understanding of signal/power integrity principles to optimize designs

· Proficient in usage of package drawing tools (Cadence APD/SiP/Allegro or equivalent)

Nice to Have Skills:

· Experience with larger LPDDR and DDR interface

· Experience with 2.XD and 3D package systems

Salary Range:$195,542-$264,557 per year