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What you’ll be doing:
Contribute to design of next generation of high-speed IOs, including NVLink and NVLink-C2C.
Responsible for IO power optimizations and continuing to push energy efficiency.
Ensure interoperability with connected devices and system components in complex interconnect topologies
Deep dive into technically challenging HSIO bugs and help drive debug efforts across various teams
Work closely and proactively with other engineering teams such as system architects, mixed signal and design, DGX, software/firmware, HW/SW QA, operations and AE teams to drive design, development, debug and release of next generations products.
What we need to see:
BS or MS degree in EE/CE or equivalent experience
8+ years working in HSIO development, bringup planning, HSIO functional and electrical validation, and/or power optimization
Experience with HSIOs like PCIE or chip-to-chip interconnects including understanding of process/temp/voltage sensitivity on BER.
Experience with identifying full chip data paths for HSIO saturation and working with applications to stress test for stability.
Experience with system level and interconnect power management optimizations
Understanding of firmware/driver structures and their interaction with HW.
Strong EE fundamentals, knowledgeable in computer architecture, high speed interfaces, timing analysis, process variations, statistical error rates and power analysis.
Effective in a collaborative environment.
You will also be eligible for equity and .
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