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Apple NAND Packaging Engineer United States, California, Cupertino 288361805
06.06.2024
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Key Qualifications
- We are looking for someone with 2+ years’ experience in package design and assembly process development for stacked-die memory packages
- Strong knowledge of wirebond and flip-chip assembly process applied to thin-die stacking
- Strong knowledge of packaging materials, substrate technology, and their mechanical and thermal behaviors
- Working knowledge of assembly design rules, SIPI, and layout tradeoffs to enable high performance DDR or differential signaling
- Solid working experience in package test and reliability, system-level downstream process interaction, and packaging inspection metrology
- Excellent engineering problem solving skills, with strong engineering physics and data driven analysis
- Strong written and verbal communication skills for working with internal multi-functional teams and OSATs
Education & Experience
BS and 3+ years of relevant industry experience
Pay & Benefits
- At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $138,900 and $256,500, and your base pay will depend on your skills, qualifications, experience, and location.Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.
Apple is an equal opportunity employer that is committed to inclusion and diversity. We take affirmative action to ensure equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics.
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