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Apple NAND Packaging Engineer United States, California, Cupertino 288361805
02.05.2024
Key Qualifications
- We are looking for someone with 2+ years’ experience in package design and assembly process development for stacked-die memory packages
- Strong knowledge of wirebond and flip-chip assembly process applied to thin-die stacking
- Strong knowledge of packaging materials, substrate technology, and their mechanical and thermal behaviors
- Working knowledge of assembly design rules, SIPI, and layout tradeoffs to enable high performance DDR or differential signaling
- Solid working experience in package test and reliability, system-level downstream process interaction, and packaging inspection metrology
- Excellent engineering problem solving skills, with strong engineering physics and data driven analysis
- Strong written and verbal communication skills for working with internal multi-functional teams and OSATs
Education & Experience
BS and 3+ years of relevant industry experience
Pay & Benefits
- At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $138,900.00 and $256,500.00, and your base pay will depend on your skills, qualifications, experience, and location.Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.
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