HP Engineering Internship - Imaging Print 

United States, Idaho, Boise 

2541091

Engineering Internship - Imaging and Print

Our future success depends on the innovation and fresh ideas students bring to HP, Inc. We are hiring students with a diverse set of skills and experiences to join us, across the different organizations that make us HP, inc. Our intern program is intended to enhance your overall learning experience, give you an opportunity to make an impact, have some fun, and meet great people along the way.

Skill Areas:

Electrical Engineering:

• Skill Areas:
  Python, C, EE Design, FPGA,Basic 2D/3D Design- CAD, ASICS(both analog and digital), data conversions- ADC and DAC, DVM, oscilloscope, Logic analyzer

Engineering Services Designer:

• Skill Areas:Repair and maintenance of complex IC manufacturing equipment (pneumatics, robotics, electronics, software, vacuum theory, etc)

Mechanical Engineering:

• Skill Areas: Mechanical Design, CAD, coding Python, C,

Material Analyst/Engineer:

• Skill Areas:
  Thermal Analysis, DSC TSC,thermodynamics, fluids, mechanics of materials, fluids, mechanics of materialsReliability testing knowledge, CAD, data center knowledge, electrical components

Chemical Engineer:

• Skills Areas: S
  tatistics, and data analysis. Autocad, Ability to understand roll to roll manufacturing processes (eg papermaking and coating operations)willingness to learnultrapure water systems, industrial wastewater systems, acid abatement scrubbers, pumped chemical systems, gas delivery systems.

MEMS Fabrication Developer:

• Skills Areas: CAD, Mechanical systems design, Statistics, cleanroom experience, process development,

Construction Engineering Project Manager:

• Skills Areas:
  Construction Engineering Project Management. Focus on Fab, Lab, Manufacturing space and infrastructure Mechanical, Electrical, Plumbing (MEP)).

Systems Engineer:

• Skills Areas: Python, C++, Familiarity with scripting, algorithm development, and system engineering.

Education and Experience Required:

• 3rd Year of Bachelor's degree completed or 1st year of Master's programcompleted.--typicallya technical degree specialization.

• Must be enrolled full time at an accredited university.

• Able to obtain work authorization in the United States in 2026, and not require sponsorship in the future.

Preferred Majors/Programs:

• Electrical Engineer
• Computer Science
• Mechanical Engineering

Preferred Knowledge and Skills:

• Project experience demonstrating strong analytical, modeling and research skills

• Strong executive-level presentation skills (storyboarding, development, and delivery)

• Demonstrable success in delivering results in a cross-functional team setting

• Ability to handle ambiguity and unstructured work situations

• Team player who supports others and leads executives and peers through logical reasoning and relationship development

• Strong public speaking andworkshop/conversation-facilitationskills

• Demonstrated ability to shape and influence ideas and actions of others

• Working knowledge of MS PowerPoint and MS Excel

The pay range for this position is $29 to $35 per hour (applies to US candidates only).  Pay varies by work location, job-related knowledge, skills, and experience.

HP offers a comprehensive benefits packagefor US Interns working at least 20 hours weekly, including:

• Health insurance
• Dental insurance
• Vision insurance
• Long term/short term disability insurance
• Employee assistance program
• Flexible spending account
• Life insurance
• Generous time off policies, including;
  • 4-12 weeks fully paid parental leave based on tenure
  • 13 paid holidays
  • 15 days paid time off ( )
  • Available hours are pro-rated based on hire date and scheduled hours

Full time

No shift premium (United States of America)

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Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.