Intel Data Center Customer System Enabling Engineer 

Taiwan, Taipei 

197715035

Job Description:

• Provide architectural consult and technical support to enable OEMs/ODMs design AI/server systems with solutions that incorporate one or more Intel products and technologies.

• Closely collaborate with internal stakeholders and OEMs/ODMs to transform opportunities to system/rack designs and product wins.

• Drive OEMs/ODMs design development and issue resolution to ensure their time to market readiness aligned with Intel product schedule.

• Initiate and enable innovativesolutions/tools/methodologies

• Evaluate, design, and develop new software and hardware fixtures and utilize tools during project deployment to validate and optimize product quality and performance.

• Create product specifications, hardware design guides, application notes, and/or supporting technical collateral.

• Lead and/or support ecosystem/industry enablement trainings and events as needed.

• Partners with customer RD and manufacturing to ensure smooth product ramp through integrating customer DFx requirements, mitigating customer factory challenges, delivering product training, and providing health oversight with rapid technical support and systematic improvement action.

Qualifications:

You must possess a Bachelor degree and/or a Master degree in Electrical Engineering or Computer Science with a minimum of 10years of Hardware development validation or technical support working experience in server workstation products design and strong customer communication skills

Additional qualifications include:

• Demonstrated experience in AI server board and system design including developing the PCB assemblies of server system from concept to production

• Multiple related electrical development experiences are required including Cadence Concept Schematic Capture reviewing PCB layout using Allegro tools PCB interconnect schemes Hot swap and power components understanding of mechanical chassis design and multi board interoperability schemes

• Demonstrated ability to lead cross organizational technology and product development projects requirements management project planning statement of work creation execution management risk management budget management etc

• Demonstrated experience developing and leading development of board and system products including direct experience with mechanical thermal electrical BIOS firmware and power design

• Proven ability to lead cross organizational teams where participants are not direct reports motivate technical contributors and spur innovation

• Effective negotiation skills with proven abilities to achieve mutually successful business outcomes with internal organizations and external customers

• Demonstrated tolerance of ambiguity with and flexibility in managing customer changes

• Bi-lingual communication skills in English and Mandarin with a demonstrated ability to work across geographies time zones companies and organizations

• Experience working with OCP HW modular design frameworks

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